During the massive growth of WLCSP in the semiconductor market, over 30 different kinds of probe heads were designed to meet the demand of the market. A Pogo-Pin design improves the durability of the probe head significantly. Additionally, coplanarity errors induced by differently sized solder balls can be avoided by our Pogo-Pins which have a working-travel designed for up to 250um. We offers a wide variety of head types to accommodate the different fields of application. A full list of head types with detailed description can be found in our catalog.
Probe Head | Specification |
Min. Pitch | 0.20mm |
Max. Site Counts | 32 Sites |
Top Housing Material | Photoveel®/VESPEL®SCP5000 |
Mounting Plate Material | Torlon® 5530 |
Bottom Housing Material | VESPEL®SCP5000 |
Life Time (Pin) | >300’000 |
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