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Connectors for Extreme Environments
3 Ekim 2019
General Final Test Solutions
3 Ekim 2019

Wafer Level Test Solutions

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During the massive growth of WLCSP in the semiconductor market, over 30 different kinds of probe heads were designed to meet the demand of the market. A Pogo-Pin design improves the durability of the probe head significantly. Additionally, coplanarity errors induced by differently sized solder balls can be avoided by our Pogo-Pins which have a working-travel designed for up to 250um. We offers a wide variety of head types to accommodate the different fields of application. A full list of head types with detailed description can be found in our catalog.

Probe Head Specification
Min. Pitch 0.20mm
Max. Site Counts 32 Sites
Top Housing Material Photoveel®/VESPEL®SCP5000
Mounting Plate Material Torlon® 5530
Bottom Housing Material VESPEL®SCP5000
Life Time (Pin) >300’000

 

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